Among the participants are Johnny Saroji, senior vice president at Apple, Erwin Federman, the legendary venture capital investor from Silicon Valley Prof. Steve Farber, the developer of the ARM processor architecture - the most popular for smart phones, Paul de Bot and more.
ChipEx2016, the annual conference of the Israeli microelectronics industry will be held this year on May 8-9 in Tel Aviv with the participation of a series of global experts who will come to Israel from all over the world. Among the participants are Johnny Srouji, senior vice president at Apple, Erwin Federman, the legendary venture capital investor from Silicon Valley (the investor behind SanDisk, Mellanox, GoPro and Checkpoint) as well as the former chairman of the American Chip Industry Association, Prof. Steve Farber, developer of the ARM processor architecture - the most popular for smart phones, Paul de Bot, senior director of emerging businesses at the chip giant TSMC, Prof. Uri Weiser, developer of the Pentium architecture at Intel, Satinder Paul Singh, Huawei's specialist in the field of IOT, Prof. G. Wong, an analog chip development expert at Tsinghua University, Hasan Trikoi, CEO of the Secure - IC company specializing in information security for the chip field, and Ronan Steyer, senior director and chip development expert for the automotive industry at the global NXP company.
In addition, dozens more lecturers and facilitators from all over the world will participate in the conference, who will come to the conference, which is considered the professional summit meeting of all those involved in the design, development, and manufacture of chips, components, electronic cards, and integrated systems. This year, the conference will open with a festive opening ceremony for industry executives on May 8, at the Tel Aviv Hilton Hotel's banquet center. The professional conference and the accompanying exhibition will be held on May 9, 2016 at the fair center, the exhibition grounds in Tel Aviv.
Shlomo Gerdman, general chairman of ChipEx2016, says: "The Israeli chip industry is currently considered the most advanced in the world. This is one of Israel's areas of specialization and therefore all the leading companies in the field including Intel, Apple, Samsung, Amazon, Texas Instruments, Broadcom and Qualcomm develop their most advanced chips here. I am happy and proud of the battery of experts who will come to the conference from all over the globe. The ChipEx2016 conference has become a household name in the global industry and therefore many experts have accepted our invitation and will come to Israel specifically to take part in this important conference.
About 100 companies supplying components, tools and services, from the USA, Germany, Italy, France, Great Britain, Russia, the Netherlands, Belgium, India, Japan, China and Taiwan, will present at the exhibition innovative tools and services offered to the local microelectronics industry.
About 1,500 people from the industry are expected to participate in the conference, including engineers, development managers, vice presidents, CEOs of companies in the field of microelectronics, venture capital investors and professional experts for the industry.
The ChipEx2016 conference is organized by TapeOut, the magazine of the Israeli chip industry and Chiportal in collaboration with SIA - the industry association in the USA, and Semi - the international association of the chip industry.
All the professional lectures at ChipEx2016 were selected by a professional steering committee consisting of senior academics and industry members headed by Prof. Ran Ginosar, head of the Research Center for VLSI Systems at the Technion and professional chairman of ChipEx2016. Following the discussion held by the steering committee, Prof. Ran Ginosar said:
This year, several innovative technologies developed in Israel thanks to the innovation and creativity of Israeli engineers will be presented at the conference. From the many applications received, we selected the best ones and I am happy to enable the industry people to learn about these innovations through their presentation at ChipEx2016″.
