will accelerate 1,000 times the activity of the processors
IBM and 3M will jointly develop a first-of-its-kind electronic "glue" that will allow the packaging of semiconductors into dense "towers" of chip circuits that stand one above the other.
The agreement signed between the two companies aims to create a new type of materials, which will make it possible for the first time to build microprocessors that include up to 100 chips in the format we are familiar with today - in one case, one above the other.
The new technology will open the way to higher levels of component integration, in computer systems and consumer electronics applications. Thus, it will be possible, for example, to closely integrate the main processor and between the memory and the communication chips - in order to create a "building block" made of silicon, which will operate a thousand times faster than the fastest processors known to us today.
The cooperation agreement between IBM and 3M may lead to a leap forward in the attempts underway in the industry, to package computer chips in a three-dimensional format, which has many advantages compared to the format of one-dimensional chips. Mainly due to the ability to "pack" more processing power in the same area.
The joint research will tackle some of the most problematic issues on the way to moving to XNUMXD chips. Thus, for example, new types of glue - of the type developed as part of the collaboration - are required in order to efficiently conduct and disperse the heat generated in a particularly compressed three-dimensional package - and to keep it away from sensitive components such as logic circuits.
The chips produced today in the microelectronics industry - including those that include what are known as "three-dimensional transistors", are actually still two-dimensional structures, on a flat surface. The joint work of IBM and 3M is designed to enable the packaging of enormous computing power into chip units on a new scale, in a format that IBM defines as "silicon skyscrapers". These new chips will make it possible to meet the ever-increasing demands of system giants such as tablet computers and smart phones, to improve processor performance without increasing current consumption.
Semiconductors found today in servers, end systems and gaming machines, today make use of package and connection technologies implemented at the single chip level. IBM and 3M plan to develop an adhesive that will be applied directly onto the silicon wafer, and will simultaneously coat hundreds or even thousands of chips that are on this wafer even before they are separated into individual units.
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What is a one-dimensional chip? Spread on a line of infinitesimal thickness?
"In order to create a building block made of silicon, which will operate a thousand times faster than the fastest processors known to us today"
Oh oh this is just amazing! Is the singularity close?? !!
: )
https://www.hayadan.org.il/ibm-synapse-chip-2508119
Something is not clear to me, why do we even need this glue? Why can't the same 100 layers be stacked together and fastened together in one case? Why is glue needed at all between the layers? What is his role?
I would love explanations,
Thanks.
Great idea laptop
I don't think this is a particularly big breakthrough.
The big problems with chip stacking are:
1) Connecting/wiring the chips to each other - this is done today but not efficiently (narrow bandwidth between the layers, higher dropout percentages as the number of layers increases, etc.)
2) Cost. Each layer costs a lot of money because it is produced separately and only then the layers are assembled.
There is no saving in silicon area (which is the cost). Just pack this area at the end more densely.
A real breakthrough would be to create silicon with transistors in many layers - and not to create one layer and then stick it on another layer.
The resulting heat will be very problematic
Oops, I just saw (and remembered) that the title says 'electronic glue'. forgiveness.
Where did the material written in the article come from?
Anyway, brilliant idea. Of course it is a trade secret - but it is interesting to know what materials this glue will be made of, and how they will be able to overcome the interference that will be created between the connected materials. Will it be some kind of 'electronic glue'?